At CES 2019, Intel previewed a new client platform, code named “Lakefield,” featuring the first iteration of its new innovative Foveros 3D packaging technology. This hybrid CPU architecture enables combining different pieces of IP that might have previously been discrete into a single product with a smaller motherboard footprint, which allows OEMs more flexibility for thin and light form factor design. Lakefield is expected to be in production this year. (Credit: Intel Corporation)
More: 2019 CES: Intel Showcases New Technology for Next Era of Computing
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